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KINGBO RMA-218 No-Clean Solder Flux(100g)
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KINGBO RMA-218 No-Clean Solder Flux(100g)
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The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates

 

 

 KINGBO RMA-218 No-Clean Solder Flux (100g) Flux @ the BGA store Ltd


 Synthetic materials
 Can reflow high temperature alloys up to 300°C
 Complies with RoHS directive 2002/95/EC
 Excellent wetting compatibility with most board finishes
 Low voiding and mid-chip beading
 Residue can be left on or removed using water Alloys
 KINGBO manufactures a low-oxide, spherical and uniformly sized powder. LF-4300 is available in the following alloys: Sn96.5/Ag3.0/Cu.5, Sn96.5/Ag3.5, Sn99.3/Cu.7, Sn95/Sb5 and Sn95/Ag5 alloys.


Powder Distribution
Micron Size Type Pitch Requirements
75 - 45 Type-2 24mil & above
45 - 25 Type-3 16mil to 24 mil
38 - 20 Type-4 12mil to 16mil
25 - 15 Type-5 <12mil


Available Packaging

The following packaging options are available for stencil printing and dispensing applications:
250g and 500g jars; 250g and 700g cartridges;
750g ProFlow
cassettes; 35g and 100g syringes; 2,500g FreshMix
Stencil Life

Kits.
>8 hrs. @ 30–45% RH & 22–25°C
~4 hrs. @ 45–70% RH & 22–25°C
An ISO 9001 Certified Company


Viscosity


Printing applications: 600 to 900Kcps +/-10%
Dispensing applications: 400Kcps +/-10% Tested according to IPC-TM-650
Tack Value
Typical tackiness: 37g force
Printing
The print definition of LF-4300 is ideal for fine pitch applications. The stencil life of this water-soluble product virtually eliminates waste of solder paste.

Consult the powder distribution chart to determine your mesh size requirements.
Printer Operation
The following are general guidelines for stencil printer optimization with KIngbo. Some adjustments may be necessary based on your process requirements.
Print Speed: 25–100mm/sec
Squeegee Pressure: 0.2–0.7kg/inch of blade
Under Stencil Wipe: Once every 10–25 prints or as necessary


Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using water at 60°C or
99% isopropyl alcohol (IPA). Post-reflow cleaning using water
at 40-60°C with 30-50 PSI pressure.
Storage and Handling Procedures
Refrigerated storage at 42–47°F will prolong the solder paste
shelf life to no less than 6 months. Syringes & cartridges should
be stored vertically with the dispensing tip down. Solder paste
should be allowed to reach ambient temperature naturally, prior
to use (about 6-8 hours). NEVER FREEZE SOLDER PASTE.

 

 

This profile was designed to serve as a starting point for process optimization using LF-4300. A cool down rate of (-) 2–4°C/second is ideal for the formation of a fine grain structure without risking
damage to thermally sensitive components.



The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Users of our products should make their own tests to determine the suitability of each product for their particular process. the BGA store Ltd will assume no liability for results obtained or damages incurred through the application of the data presented.



* Touch-up and rework

* Attachment of BGA spheres

* Soldering Flip Chip components

* Excellent wetting compatibility

* Wide reflow window

* Compatible with most board finishes

 

 

100 Ml Tub of Amtech LF 4300 flux

 

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